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| *Customer: Pb Free SPECIFICATION ITEM MODEL Revision Date CHIP LED DEVICE SSC-THBTGFR5210 [Contents] 1. Features 2. Absolute maximum ratings 3. Electro-optical characteristics 4. Characteristic diagrams 5. Soldering profile 6. Outline dimension 7. Packing 8. Reel packing structure 9. Precaution for use Customer Approved by Approved by Approved by Supplier Drawn by Checked by Approved by SSC-QP-0401-06(REV.0) SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 SSC-THBTGFR5210 Seoul Semiconductor - 1/8- 1. Features Full-color lighting SMD Chip LED which makes right-angle mounting available Dimension: 3.0(L)x1.35(W)x1.0(H) 2. Absolute Maximum Ratings Parameter Power Dissipation Symbol PD Color Red Green Blue Red Green Blue Red Green Blue 5 -30 ~ +85 -40 ~ +100 Value 60 90 25 100 Unit (Ta=25) Remarks - Forward Current Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature IF IFM*1 VR Topr Tstg - V *1 IFM Conditions: Pulse width Tw 1ms, Duty ratio 1/20 3. Electro-optical Characteristics Parameter Forward Voltage Zener Forward Voltage Luminous Intensity*2 Dominant Wavelength Spectral Bandwidth Viewing angle*3 Symbol VF VF (Z) IV Condition IF=10 IF=10 IF=10 IF=10 IF=10 IF=10 Color Red Green Blue Blue Green Red Green Blue Red Green Blue Red Green Blue Red Green Blue Min 0.6 35 55 20 610 510 470 Typ 2.1 3.1 3.0 0.8 50 80 30 625 525 474 20 35 25 150 150 150 Max 2.3 3.5 3.4 1.5 80 150 60 640 540 480 - (Ta=25) Unit V V mcd d 2 1/2 *2 The luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. *3 1/2 is the off-axis where the luminous intensity is 1/2 the peak intensity. [Note] All products confirm to the listed minimum and maximum specifications for electric and optical characteristics, when operated at 10mA within the maximum ratings shown above. All measurements were made under the standardized environment of SSC. (Tolerance: VF 0.1V, IV 10%, d 2nm) SSC-QP-0401-06(REV.0) SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 SSC-THBTGFR5210 - 2/8- 4. Characteristic Diagrams Forward Current vs. Forward Voltage Luminous Intensity vs. Forward Current 100 180 160 Relative Intensity IV[%] 140 120 100 80 60 40 Forward Current IF[mA] 10 1 RED GREEN BLUE 0.1 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 20 0 0 5 10 15 20 25 30 RED GREEN BLUE 35 40 Forward Voltage VF[V] Forward Current IF[mA] Forward Current Derating Curve Radiation Diagram 30 90 25 .0 .8 .6 .4 .2 .0 0 25 50 75 100 120 60 Forward current IF[mA] 20 15 150 30 10 5 0 -25 180 0.5 0.5 0 Ambient temperature Ta[] SSC-QP-0401-06(REV.0) SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 SSC-THBTGFR5210 - 3/8- 5. Soldering Profile Reflow Soldering Conditions/ Profile (1) Lead Solder -Preliminary heating to be at 150max. for 2 minutes max. -Soldering heat to be at 240max. for 5 seconds max. LED Surface temperature C Operation heating 240 150 ~ Pre-heating Temperature rise: 5C/sec. Cooling: -5C/sec. 120 0 60 to 120 sec. 5sec. max (2) Lead-Free Solder -Preliminary heating to be at 150max. for 2 minutes max. -Soldering heat to be at 255max. for 20 seconds max. LED Surface temperature C Operation heating 255 (+5) 150 ~ 120 0 Pre-heating Temperature rise: 5C/sec. Cooling: -5C/sec. 60 to 120 sec. 10 to 20 sec. (3) Hand Soldering conditions -Not more than 3 seconds @MAX280, under Soldering iron. SSC-QP-0401-06(REV.0) SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 SSC-THBTGFR5210 - 4/8- 6. Outline Dimension 0.5 3 2 1.0 4 3.0 1 R0.3 0.85 1.35 2.2 2.0 Marking 0.5 1 2 3 4 0.05 1.0 Resin PCB [Inner Circuit Diagram] 1.4 0.3 0.9 Green Blue Red 3.8 4 1 2 3 Anode Common [Recommended Solder Pattern] Tolerance: 0.1, 0.55 SSC-QP-0401-06(REV.0) SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 SSC-THBTGFR5210 - 5/8- 0.6 Unit: 2.0 1.35 1.0 7. Packing 0.1 4.0 0.1 1.5 -0 +0.1 1.75 2.0 0.05 0.2 0.05 3.5 0.05 (2.75) 1.10.1 1.5 0.1 3.550.1 8.0 0.2 1.2 0.1 180 +0 -3 11.4 9 0.3 2 0.2 +0.2 -0 22 13 0.2 Label Tolerance: 0.2, Unit: (1) Quantity : 3000pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10pitches to be 0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at 10 angle to be the carrier tape. (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package. SSC-QP-0401-06(REV.0) SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 60 SSC-THBTGFR5210 - 6/8- 8. Reel Packing Structure Reel P/N : # # # # # # # # # # ### SSC-THBTGFR5210 L ot N o ######### : 4000 Aluminum Vinyl Bag P/N : # # # # # # # # # # ### SSC-THBTGFR5210 Lot N o ######### : 4000 Outer Box *Material: Paper(SW3B(B)) a 7inch 245 c CHIP LED PART : SSC-THBTGFR5210 CODE : Q'YT : 40,000EA TYPE SIZE(mm) b 220 c 142 CHIP LED b a LOT NO : DATE : SEOUL SEMICONDUCTOR CO.,LTD SSC-QP-0401-06(REV.0) SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 SSC-THBTGFR5210 - 7/8- 9. Precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in the dry box (or desiccator) with a desiccant . Otherwise, to store them in the following environment is recommended. Temperature : 5~30 (2) Attention after opened However LED is correspond SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed. a. After opened and mounted, the soldering shall be quickly. Temperature : 5 ~ 40 Humidity : less than 30% b. Keeping of a fraction Humidity : 60%HR max. (3) In case of more than 1 week passed after opening or change color of indicator on desiccant components shall be dried 10-12hr. at 605. (4) In case of supposed the components is humid, shall be dried dip-solder just before. 100Hr at 805 or 12Hr at 1005. (5) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temp. after soldering. (6) Quick cooling shall not be avoid. (7) Components shall not be mounted on warped direction of PCB. (8) Anti radioactive ray design is not considered for the products listed here in. (9) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA should be used. (10) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (11) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (12) The LEDs must be soldered within seven days after opening the moisture-proof packing. (13) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (14) The appearance and specifications of the product may be modified for improvement without notice. (15) Static Electricity and surge damages the Blue/Green LEDs. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. All devices, equipment and machinery must be properly grounded. (16) It is recommended to use individual resistor separately when the LEDs applies in parallel circuit so that it may improve the light deviations. (17) It is recommended to examine to the full the circuit by using resistor when the LEDs applies in case of lighting seven colors. (White color is not available with single LED.) SSC-QP-0401-06(REV.0) SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 SSC-THBTGFR5210 - 8/8- |
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